Other members of the alliance that create a weldless mold include Sysko Corporation, which is a manufacturer of large-scale heating and cooling equipment. Their equipment is used to heat and cool, and their method of changing from heating to cooling is a changeover valve unit. They came up with a way to quickly increase and decrease temperatures to maximize fluidity of the resin, run at lower pressures to reduce the chances of flash, and also have high transferability for high-gloss and textured surfaces. This also significantly reduced overall cycle times.

Mitsubishi Corporation Technos is the builder of molding machines that have the ability to monitor temperatures to let the Sysko people see what's happening in the cavity. They also have the ability to communicate the temperature data out to the valve control system.

The other two partners were GE Advanced Materials and Fuji Seiko Company. GE is the partner that supplied the resin, which had to accept the high-temperature molding process, and cool it quickly to get the cavity open and eject the part. Fuji Seiko is the mold builder and molder that holds the Japanese patent for the 3D weldless molding die. They were the first people to pull together all the components to mold parts using the 3D weldless process.