Date: Wednesday, April 14, 2010 - Saturday, April 17, 2010
Location: Osaka, Japan
Description: Intermold, the 21st Japan Die & Mold Manufacturing Technology Exhibition, is held April 14 to 17 at the Intex Osaka in Osaka, Japan. Organized by Japan Die & Mold Industry Association and Television Osaka, the event features the latest technologies offerings in machine tools, forming equipment, grinding machines, molding machines and die/mold components and materials. Additional equipment includes measurement devices, CAD/CAM/CAE systems and rapid prototyping. For more information, visit itp.gr.jp/im/english or e-mail iminfo@itp.gr.jp.
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