3DCIC Extends Call for Speakers

The annual conference will be held in Colorado in May.

Longview Advisors, organizers of the annual 3D Collaboration & Interoperability Congress (3DCIC) has extended its second call for speakers at the 2014 event, to be held May 28-30. Hosted at the Cheyenne Mountain Conference Center in Colorado Springs, Colo., the congress is dedicated to fostering collaboration and interoperability throughout the product lifecycle. This year’s theme is “Driving Product Development with Collaboration, Simulation and Integration.” Organizers are seeking presentations from product designers, engineers and other individuals who can speak about integration, collaborative PLM, design analysis and simulation, or similar topics.

3DCIC, visit 3dcic.com.