3M Cubitron II Bonded Abrasive Grinding and Cut-Off Wheels Require Less Pressure

3M Abrasive Systems’ Cubitron II bonded abrasive grinding and cut-off wheels, include precision-shaped grain technology that cuts faster, stays sharper longer and requires less pressure than conventional grinding and cut-off wheels, the company says.

New Product Announcements From: 10/30/2013 Production Machining
Originally titled 'Abrasive Grinding and Cut-Off Wheels Require Less Pressure'

3M Abrasive Systems’ Cubitron II bonded abrasive grinding and cut-off wheels, include precision-shaped grain technology that cuts faster, stays sharper longer and requires less pressure than conventional grinding and cut-off wheels, the company says. The abrasives are designed to help reduce operator fatigue and increase productivity.

The precision-shaped grains in these grinding wheels continuously fracture to form sharp points and edges. This technology is designed to help the abrasives slice cleaner and faster, stay cooler and last longer than conventional wheels.

With the advantages of 3M’s technology, operators are subjected to less wear and tear and can remove more material with the same amount of effort, the company says. 

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