Waterjet Can Cut an Array of Substrates

The Micro waterjet machine can cut a variety of parts utilizing an array of substrates.

New Product Announcements From: 7/1/2010 Modern Machine Shop

The Micro waterjet machine can cut a variety of parts utilizing an array of substrates. The ±3 µm positioning accuracy abrasive waterjet combines waterjet cutting technology with the precision of a laser. Surface quality ranges to N7 for titanium or alloys without negative effects of process forces and thermal stress, the company says. The waterjet is said to decrease scrap rates and deburring while producing biocompatible, precision parts with tolerances ±0.01 mm.

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