Waterjet Can Cut an Array of Substrates
The Micro waterjet machine can cut a variety of parts utilizing an array of substrates.
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The Micro waterjet machine can cut a variety of parts utilizing an array of substrates. The ±3 µm positioning accuracy abrasive waterjet combines waterjet cutting technology with the precision of a laser. Surface quality ranges to N7 for titanium or alloys without negative effects of process forces and thermal stress, the company says. The waterjet is said to decrease scrap rates and deburring while producing biocompatible, precision parts with tolerances ±0.01 mm.