Die/Mold Polishing Compound Increases Productivity

Engis’s Hyprez SC diamond polishing compound for die/mold polishing is designed to increase removal rates on die/mold steels without sacrifice of finishes. The compound uses a new, sharper diamond type and special particle size distribution meant to provide better cutting action. The compound’s SC carrier provides high lubricity without being “greasy” or spinning off the felt or wood bob, the company says. It resists vaporizing at higher temperatures, which is ideal for polishing large molds in situ. Engis says that this results in faster cutting rates, better finishes and the ability to skip some polishing steps.