• MMS Youtube
  • MMS Facebook
  • MMS Linkedin
  • MMS Twitter
7/2/2008

Recirculating Chillers For Laser Marking Systems

Facebook Share Icon LinkedIn Share Icon Twitter Share Icon Share by EMail icon Print Icon

Share

Facebook Share Icon LinkedIn Share Icon Twitter Share Icon Share by EMail icon Print Icon

Related Suppliers

The company offers a line of economical chillers designed to provide reliable heat removal for laser etching, engraving and marking systems. For use with lasers and other temperature-sensitive instrumentation, the 5000 series and 6000 series recirculating chillers are capable of maintaining process temperatures from -10° to +70°C with ±0.1°C stability. They provide a maximum of 2,900 W (9.889 BTU/hour) of heat removal and are available with ¼- to 1-hp compressors.   The high-performance chillers also offer user-friendly operation, the company says. Standard features include extra-large temperature and pressure/flow rate digital readouts; one-touch temperature control; ambient temperature tracking capability; and integral temperature, pressure and flow alarms. Each chiller can be equipped with the pump type—centrifugal, positive displacement or turbine—that meets the pressure and flow rate requirements of the cooling application. A DI water package and remote control capability are also available as options.

RELATED CONTENT

  • Milling With Waterjet

    Machine with abrasive waterjet and control the depth of cut. For the right parts, this fledgling process may offer a compelling alternative.

  • The Personal Waterjet Cutting System Is a Natural Development

    Much like what is happening with desktop 3D printing, Omax has developed a way to bring the versatility, capability and simplicity of waterjet cutting to a broader spectrum of users.

  • The Promise of Waterjet Technology for Micromachining

    The potential benefits of using waterjet technology to produce parts or part features smaller than 300 microns are compelling. Developers and researchers are getting close to breaking the barriers that stand in the way of micromachining in the 150- to 200-micron range and below.

Related Topics

Resources