See how combining metrology and microscopy technologies can increase efficiency and reduce costs.
The growing demand for miniaturization and high-density interconnects make it increasingly difficult to identify defects, meaning a need for inspection technology that can do traditional metrology applications and optical inspection tasks in microscopy. Printed circuit boards (PCB) and printed circuit assemblies (PCA) need advanced metrology and inspection systems to build high reliability devices that are important for new energy vehicles (NEV), aerospace, spacecraft and medical device creation.
Both metrology and microscopy technologies combine to fulfill high-end geometric dimensioning and tolerancing (GD&T) tasks along with image analysis techniques required for new product development and failure analysis inspection. This trend helps manufacturers increase efficiency while saving on service costs and space.
Agenda:
- Understand how trends in electronics and medical manufacturing affect quality assurance
- Learn how microscopy inspection and metrology work together to support electronics manufacturing
- Application experts offer inspection tips and example workflows
- Understand savings made on service costs and space
